IPO Plus - IPO

Name▼ / Code▼	Industry	Offer Price	Lot Size	Entry Fee	Closing Date	Grey Market Date▼	Listing Date▲
Eastroc Beverage 09980.HK	Beverages (Non-alcoholic)	N/A	100	25,050.11	2026/01/29	2026/02/02	2026/02/03
Gon Technology 02768.HK	Diversified Chemicals	34-42	200	8,484.71	2026/01/30	2026/02/03	2026/02/04
Distinct Healthcare 02677.HK	Health Care Services	57.7-66.6	50	3,363.58	2026/02/03	2026/02/05	2026/02/06
Muyuan Foods 02714.HK	Poultry, Meat and Seafood	N/A	100	3,939.34	2026/02/03	2026/02/05	2026/02/06
Han's CNC 03200.HK	Printed Circuit Boards	N/A	100	9,676.61	2026/02/03	2026/02/05	2026/02/06
Montage Tech 06809.HK	Electronic Components	N/A	100	10,796.80	2026/02/04	2026/02/06	2026/02/09
Axera 00600.HK	Semiconductors & Semiconductor Equipment	28.2	100	2,848.44	2026/02/05	2026/02/09	2026/02/10

Name▼

Code▼

Industry

Offer Price

Lot Size

Entry Fee

Closing Date

Grey Market Date▼

Listing Date▲

Eastroc Beverage
09980.HK

Beverages (Non-alcoholic)

N/A

100

25,050.11

2026/01/29

2026/02/02

2026/02/03

Gon Technology
02768.HK

Diversified Chemicals

34-42

200

8,484.71

2026/01/30

2026/02/03

2026/02/04

Distinct Healthcare
02677.HK

Health Care Services

57.7-66.6

3,363.58

2026/02/03

2026/02/05

2026/02/06

Muyuan Foods
02714.HK

Poultry, Meat and Seafood

N/A

100

3,939.34

2026/02/03

2026/02/05

2026/02/06

Han's CNC
03200.HK

Printed Circuit Boards

N/A

100

9,676.61

2026/02/03

2026/02/05

2026/02/06

Montage Tech
06809.HK

Electronic Components

N/A

100

10,796.80

2026/02/04

2026/02/06

2026/02/09

Axera
00600.HK

Semiconductors & Semiconductor Equipment

28.2

100

2,848.44

2026/02/05

2026/02/09

2026/02/10

Summary

We are a leading global fabless IC design company focused on offering innovative, reliable and power-efficient interconnect solutions for cloud computing and AI infrastructure. We provide interconnect chips including memory interconnect chips and PCIe (peripheral component interconnect express)/CXL (compute express link) interconnect chips to industry leading customers for a wide range of end applications in data centers, servers and computers. In terms of revenue in 2024, we have emerged as the largest memory interconnect chip supplier in the world, with 36.8% market share, according to Frost & Sullivan. We provide a full range of DDR2 to DDR5 (the second to the fifths generations of double data rate technologies) memory interface chips together with DDR5 supporting chips including SPD (Serial Presence Detect), TS (Temperature Sensor), and PMIC (Power Management Integrated Circuit) chips. Our DDR5 memory interface chips are critical interconnect components between CPUs and DRAM modules in servers, enabling high-speed data transfer and stability. Our newly-launched interconnect chips, including MRCD/MDB, CKD (Clock Driver), PCIe Retimer, and CXL MXC (Memory eXpander Controller) are designed to further enhance data transfer reliability and efficiency in AI servers and PCs. We currently have two major product lines: interconnect chips and the Jintide products. Our interconnect chips primarily include memory interface chips, memory module supporting chips, PCIe/CXL interconnect chips and clock chips. Our Jintide products mainly consist of our Jintide CPU. The following chart provides an overview of our products along with their functions and applications. Interconnectivity plays an increasingly vital role in data transmission with the evolvement of modern data infrastructure. As processing power accelerated at a remarkable rate, it created a fundamental imbalance across computer systems. Processors began to operate so quickly that they were often held back by the slower pace of improvement in memory bandwidth, creating a critical performance bottleneck. Memory interface chips emerged as critical interconnect solutions to overcome this bottleneck, enabling memory to keep pace with computing and unlocking maximum system performance. The need for a data-centric infrastructure is driven by the demands of managing unprecedented volumes of data with high quality and overcoming the discrepancy between processor speed and memory bandwidth, while at increasingly faster transfer rates and across a new, heterogeneous system architecture. This architecture is no longer centered solely around CPUs but now includes GPUs and a range of interconnected devices in increasingly complex configurations. In addition, it has reshaped system design around three pillars: computing, memory and interconnectivity. The importance of interconnect is expected to continue to grow, as it underpins the efficiency, reliability, low-latency and scalability of data-centric systems. Interconnect requires comprehensive solutions that not only address data movement to and from memory but also enable seamless communication across the entire system infrastructure within servers, between servers at the rack level, and across clusters. This demand has driven the ongoing evolution of memory interface technologies alongside the latest advancements in PCIe/CXL, Ethernet and optical interconnects, ensuring efficient and scalable data transfer across diverse system architectures. As intelligence and computing technologies evolve, the need for faster data transfer between components increases, which is directly expanding the overall market size for interconnect chips. For details, see “Market Development.” Based on open industry standards, our interconnect solutions, mainly comprised of memory interconnect chips and PCIe/CXL interconnect chips as well as accompanying software and technical support services, effectively addresses interconnect bottlenecks while enhancing data rate/bandwidth, reliability, and power efficiency across various systems such as processors and memory modules. They realize such functions by supporting multiple standardized communication protocols. Interconnect solutions facilitate accurate and efficient data transfer, supporting overall system performance and stability. We have achieved strong overall topline growth during the Track Record Period, generating RMB3,672.3 million, RMB2,285.7 million, RMB3,638.9 million and RMB4,057.7 million in revenue in 2022, 2023, 2024, and the nine months ended September 30, 2025, respectively. Our newly launched interconnect chips including PCIe Retimer, MRCD/MDB and CKD generated revenue of RMB422.5 million in 2024. Additionally, we have maintained a robust margin profile, supported by continuous product innovation. Our overall gross profit margin was 46.4%, 58.9%, 58.1% and 61.5% in 2022, 2023 and 2024 and the nine months ended September 30, 2025, respectively. Our long-standing partnerships with customers and ecosystem collaborators have been instrumental in driving sustained growth and profitability, strengthening our leading position in the industry. Source: Montage Tech (06809) Prospectus (IPO Date : 2026/01/30)
Listing Market	MAIN
Industry	Electronic Components
Background	H Shares
Major Business Area	Global

Corporate Information

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